1+ months

Sr. Packaging Engineer - 79129

Advanced Micro Devices


What you do at AMD changes everything

At AMD, we push the boundaries of what is possible. We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies building blocks for gaming, immersive platforms, and the data center.

Developing great technology takes more than talent: it takes amazing people who understand collaboration, respect, and who will go the extra mile to achieve unthinkable results. It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world. If you have this type of passion, we invite you to take a look at the opportunities available to come join our team.

Sr. Packaging Engineer

This role:

AMDs Packaging Engineering team is looking for an experienced IC Packaging Engineer who will help solve complex technical challenges to deliver robust, reliable, efficient packages & drive assembly solutions aligned with the end-product requirements. AMD is bolder than ever, focused, and energized - you can make a career move that matters! Help turn "possibility" into "reality" every day!

This person:

Will Build, conduct, and analyze the Design of Experiments (DOE) for development and sustaining activities. Develop and lead programs that utilize AMDs industry-leading chipset and packaging architecture. Utilize hands-on expertise of assembly processes for flip-chip package development, coordinate with suppliers, process engineers, and contract manufacturers to define the process flow and ensure manufacturability. Seek technical issues on package reliability, materials, and assembly process by working closely with assembly and material suppliers, conduct package routing feasibility studies, together with silicon and PCB teams to arrive at a design that meets performance, cost, yield, and quality objectives. Support initial package design & development activities to enable new test vehicles, package layer stack up selection, and ensure critical package level performance. Define package design processes and methodologies to improve layout efficiency. Work multi-functionally to understand trade-offs, constraints, and optimizing silicon floor plan, bump, and package pinout.

Key responsibilities:

  • Background in electronic packaging development in related environments - SiP, MCM, flip-chip BGA, CSP packaging, etc.
  • Experience working with tier 1 substrate and assembly suppliers for process engineering and package development.
  • Direct experience with SOC packaging design, assembly, and reliability analysis.
  • 3+ years of hands-on experience with Cadence APD/SIP and CAM350
  • Hands-on experience in using AutoCAD\
  • Understanding of semiconductor reliability principles
  • Knowledge of I. C. Package types used in the semiconductor industry
  • Science or Physics required and proven experience within the technical field. MS or Ph.D. preferred.
  • Ability to work independently and with multi-functional, multi-geographical teams
  • Excellent communication and organizational skills.

Education:

  • BS or MS Electrical Engineering, Mechanical Engineering, Materials

Location

  • Santa Clara, CA

 

#LI-ZL2



Requisition Number:79129
Country:United StatesState:CaliforniaCity:Santa Clara
Job Function:Packaging Engineering

AMD does not accept unsolicited resumes from headhunters, recruitment agencies or fee based recruitment services. AMD and its subsidiaries are equal opportunity employers. We consider candidates regardless of age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status. Please click here <>for more information.

Posted: 2020-04-23 Expires: 2020-05-29

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Sr. Packaging Engineer - 79129

Advanced Micro Devices

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